ACCμRA OPTO

Applications

? Laser diode, laser bar ? VCSEL, photo diode

? LED

? Prisms, lenses, mirrors ? Micro assembly 

? Flip-chip bonding, die bonding

? Chip-to-chip, chip-to-substrate bonding 

Specifications

? Accuracy* ±0.5 μm

?Post-bond accuracy: +/- 1 μm 

?Range of force : 20 g to 1 kg

?Temperature up to 400°C 

Independent heating for chip and substrate 

?High resolution vertical movement 

74 mm, resolution 0.01μm Driven by brushless motor